Technology Principle
Our EMI elimination system is designed around three integrated control layers:
1. Shielding Control
Reduces electromagnetic coupling through conductive barriers or shielded structures.
2. Grounding Optimization
Provides controlled grounding pathways to prevent floating potentials and ground loops.
3. Static Dissipation
Controls surface and volume resistivity to minimize charge accumulation.
Optional advanced integration:
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SWCNT-enhanced conductive polymer layers
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Hybrid metallic shielding modules
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RF spectrum adaptive mitigation
Product Architecture
Available product configurations:
▸ EMI Shielded Tubing System
For chemical and process lines.
▸ EMI Shielded Panel / Enclosure
For tool housing and electronic compartments.
▸ EMI Dissipative Components
Valves, connectors, fittings with controlled resistivity.
▸ Modular EMI Suppression Units
Standalone modules integrated into tool or facility systems.
▸ Grounded Multilayer Composite Structures
Custom-engineered based on frequency environment.
Applications
▸ Chemical Delivery Lines
Reduces EMI coupling affecting flow meters and sensors.
▸ Plasma & RF Adjacent Areas
Minimizes RF noise interference.
▸ Tool Sensor Systems
Improves measurement consistency.
▸ UPW Distribution Systems
Enhances electrical stability in monitoring circuits.
▸ FOUP & Environmental Modules
Reduces electrostatic-induced particle attraction.
Engineering Advantages
✓ Lower electrical noise
✓ Improved process repeatability
✓ Reduced static-related particle adhesion
✓ Increased yield stability
✓ Compatible with cleanroom standards
✓ Retrofit-ready design